Datasheet TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375 (Texas Instruments) - 4

TLV2370, TLV2371, TLV2372 TLV2373, TLV2374, TLV2375
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
www.ti.com TLV2371 DBV Package TLV2371 D and P Packages 5-Pin SOT-23 8-Pin SOIC and PDIP Top View Top View
OUT 1 5 V NC NC DD 1 8 IN- 2 7 VDD GND 2 IN + 3 6 OUT GND 4 5 NC IN+ 3 4 IN-
Pin Functions: TLV2371 PIN I/O DESCRIPTION NAME SOT-23 SOIC, PDIP
GND 2 4 — Ground connection IN– 4 2 I Negative (inverting) input IN+ 3 3 I Positive (noninverting) input NC — 1, 5, 8 — No internal connection (can be left floating) OUT 1 6 O Output VDD 5 7 — Positive power supply
TLV2372 D, DGK, and P Packages 8-Pin SOIC, VSSOP, and PDIP Top View
1OUT 1 8 VDD 1IN 2 7 2OUT - 1IN+ 3 6 2IN- GND 4 5 2IN+
Pin Functions: TLV2372 PIN I/O DESCRIPTION SOIC, VSSOP, NAME PDIP
GND 4 — Ground connection 1IN– 2 I Inverting input, channel 1 1IN+ 3 I Noninverting input, channel 1 2IN– 6 I Inverting input, channel 2 2IN+ 5 I Noninverting input, channel 2 1OUT 1 O Output, channel 1 2OUT 7 O Output, channel 2 VDD 8 — Positive power supply 4 Submit Documentation Feedback Copyright © 2001–2016, Texas Instruments Incorporated Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information