Datasheet MCP6001, MCP6001R, MCP6001U, MCP6002, MCP6004 (Microchip) - 3

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MCP6001/1R/1U/2/4 1.0 ELECTRICAL † Notice:
Stresses above those listed under “Absolute
CHARACTERISTICS
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those
Absolute Maximum Ratings †
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended VDD – VSS ..7.0V periods may affect device reliability. Current at Analog Input Pins (VIN+, VIN–)...±2 mA
††
See
Section 4.1.2 “Input Voltage and Current Limits”
. Analog Inputs (VIN+, VIN–) †† .. VSS – 1.0V to VDD + 1.0V All Other Inputs and Outputs ... VSS – 0.3V to VDD + 0.3V Difference Input Voltage .. |VDD – VSS| Output Short Circuit Current .. Continuous Current at Output and Supply Pins ..±30 mA Storage Temperature ... –65°C to +150°C Maximum Junction Temperature (TJ)... .+150°C ESD Protection On All Pins (HBM; MM) .. ≥ 4 kV; 200V
DC ELECTRICAL SPECIFICATIONS Electrical Characteristics
: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VL = VDD/2, R ≈ L = 10 kΩ to VL, and VOUT VDD/2 (refer to Figure 1-1).
Parameters Sym Min Typ Max Units Conditions Input Offset
Input Offset Voltage VOS -4.5 — +4.5 mV VCM = VSS
(Note 1 )
Input Offset Drift with Temperature ΔVOS/ΔTA — ±2.0 — µV/°C TA= -40°C to +125°C, VCM = VSS Power Supply Rejection Ratio PSRR — 86 — dB VCM = VSS
Input Bias Current and Impedance
Input Bias Current: IB — ±1.0 — pA Industrial Temperature IB — 19 — pA TA = +85°C Extended Temperature IB — 1100 — pA TA = +125°C Input Offset Current IOS — ±1.0 — pA Common Mode Input Impedance ZCM — 1013||6 — Ω||pF Differential Input Impedance ZDIFF — 1013||3 — Ω||pF Common Mode Common Mode Input Range V − CMR VSS 0.3 — VDD + 0.3 V Common Mode Rejection Ratio CMRR 60 76 — dB VCM = -0.3V to 5.3V, VDD = 5V
Open-Loop Gain
DC Open-Loop Gain (Large Signal) AOL 88 112 — dB VOUT = 0.3V to VDD – 0.3V, VCM = VSS
Output
Maximum Output Voltage Swing VOL, VOH VSS + 25 — VDD – 25 mV VDD = 5.5V, 0.5V Input Overdrive Output Short Circuit Current ISC — ±6 — mA VDD = 1.8V — ±23 — mA VDD = 5.5V
Power Supply
Supply Voltage VDD 1.8 — 6.0 V
Note 2
Quiescent Current per Amplifier IQ 50 100 170 µA IO = 0, VDD = 5.5V, VCM = 5V
Note 1:
MCP6001/1R/1U/2/4 parts with date codes prior to December 2004 (week code 49) were tested to ±7 mV minimum/ maximum limits.
2:
All parts with date codes November 2007 and later have been screened to ensure operation at VDD = 6.0V. However, the other minimum and maximum specifications are measured at 1.8V and 5.5V. © 2009 Microchip Technology Inc. DS21733J-page 3 Document Outline 1.0 Electrical Characteristics 1.1 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Quadratic Temp. Co. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 1.8V. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Bias Current at +85°C. FIGURE 2-8: Input Bias Current at +125°C. FIGURE 2-9: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-10: PSRR, CMRR vs. Frequency. FIGURE 2-11: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-12: Input Noise Voltage Density vs. Frequency. FIGURE 2-13: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-14: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Small-Signal, Non-Inverting Pulse Response. FIGURE 2-17: Large-Signal, Non-Inverting Pulse Response. FIGURE 2-18: Slew Rate vs. Ambient Temperature. FIGURE 2-19: Output Voltage Swing vs. Frequency. FIGURE 2-20: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-21: The MCP6001/2/4 Show No Phase Reversal. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-3: Output resistor, RISO stabilizes large capacitive loads. FIGURE 4-4: Recommended RISO values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-5: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-7: Instrumentation Amplifier with Unity-Gain Buffer Inputs. FIGURE 4-8: Active Second-Order Low-Pass Filter. FIGURE 4-9: Peak Detector with Clear and Sample CMOS Analog Switches. 5.0 Design AIDS 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Circuit Designer & Simulator 5.4 Microchip Advanced Part Selector (MAPS) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information