Datasheet ZSSC4175D-01 (IDT) - 7

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4. Operating Conditions
The operating conditions below specify the conditions that the application circuit must provide to the device during operation for proper function. Unless otherwise stated, the parameter limits in this section are applied as test conditions for the electrical parameters specified in sections 5.
Table 3. Recommended Operating Conditions No. Symbol Parameter Conditions Min Typ Max Unit
DP_001 VDDE Supply voltage VDDE to VSSE 4.5 5 5.5 V DS_011 VDDE_OP[a] Extended operation supply VDDE to VSSE; derated accuracy and 4 6 V voltage [a] derated SENT pulse shaping outside of normal supply range VDDE Note for a supply greater than 5.5V: Above the ZSSC4175D-01 over-voltage limitation threshold, the output potential is clipped at this threshold DS_012 TAMB [b], [c] Ambient temperature[b] Temperature range -40 150 C Informal [d] Rth_JA_QFN24 [a] Thermal resistance 24-QFN According to JESD 51 32 K/W [a] No measurement in mass production; parameter is guaranteed by design and/or quality observation. [b] Temperature stress over lifetime is restricted to the Temperature Profile described in section 12 or to similar stress caused by equivalent temperature profiles. Contact IDT for a calculation sheet Temperature Profile Calculation Sheet for temperature stress calculation. See the last page for contact information. [c] Assuming application conditions according to Test Board Design as per JESD51-7 and natural convection Test Conditions as per JESD51-2. [d] Package-related parameter. © 2019 Integrated Device Technology, Inc. 7 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History