Datasheet ICM7555 (NXP) - 4

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NXP Semiconductors ICM7555 General purpose CMOS timer 8. Limiting values Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 18 V VI input voltage TRIGGER [1] −0.3 VDD + 0.3 V CONTROL_VOLTAGE −0.3 VDD + 0.3 V THRESHOLD −0.3 VDD + 0.3 V RESET −0.3 VDD + 0.3 V IO output current - 100 mA P power dissipation Tamb = 25 °C (still air) [2][3] DIP8 package - 1160 mW SO8 package - 780 mW Tstg storage temperature −65 +150 °C Tsp solder point temperature soldering 60 s - 300 °C [1] Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than VDD + 0.3 V or less than GND − 0.3 V may cause destructive latch-up. For this reason it is recommended that no inputs from external sources not operating from the same power supply be applied to the device before its power supply is established. In multiple systems, the supply of the ICM7555 must be turned on first. [2] Above 25 °C, derate at the following rates: DIP8 package at 9.3 mW / °C SO8 package at 6.2 mW / °C [3] Refer to Section 11.2 “Power supply considerations” section.
9. Characteristics Table 5. Characteristics
Tamb = 25 °C unless otherwise specified.
Sym Parameter Conditions Min Typ Max Unit bol
VDD supply voltage Tmin ≤ Tamb ≤ Tmax 3 - 16 V IDD supply current[1] VDD = Vmin - 50 200 µA VDD = Vmax - 180 300 µA
Astable mode timing[2][3]
∆f/f frequency stability - 1.0 5.0 % ∆f/∆V frequency variation with voltage - 0.1 3.0 %/V ∆f/∆T frequency variation with VDD = 5 V - 50 - ppm/°C temperature[4] VDD = 10 V - 75 - ppm/°C VDD = 15 V - 100 - ppm/°C VI input voltage TRIGGER: VDD = 5 V 0.29VDD 0.31VDD 0.34VDD V CONTROL_VOLTAGE: VDD = 5 V 0.62VDD 0.65VDD 0.67VDD V THRESHOLD: VDD = 5 V 0.63VDD 0.65VDD 0.67VDD V RESET: VDD = Vmin and Vmax 0.4VDD 0.7VDD 1.0VDD V ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 4 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents