Datasheet ADXL375-EP (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | 3-Axis, ±200 g Digital MEMS Accelerometer |
| 页数 / 页 | 7 / 6 — ADXL375-EP. Enhanced Product. TYPICAL PERFORMANCE CHARACTERISTICS. 1.0. … |
| 文件格式/大小 | PDF / 259 Kb |
| 文件语言 | 英语 |
ADXL375-EP. Enhanced Product. TYPICAL PERFORMANCE CHARACTERISTICS. 1.0. 23.0. 0.8. 22.5. 0.6. 22.0. ) /g. 0.4. 21.5. 0.2. Y (L. 21.0. IFT (. IVI. 20.5. T D
该数据表的模型线
文件文字版本
ADXL375-EP Enhanced Product TYPICAL PERFORMANCE CHARACTERISTICS 1.0 23.0 0.8 22.5 0.6 22.0 ) /g 0.4 ) 21.5 SB g 0.2 Y (L 21.0 IFT ( T R IVI 0 T 20.5 T D SI E –0.2 20.0 OFFS S SEN –0.4 XI 19.5 X-A –0.6 19.0 –0.8 18.5 –1.0 18.0 –55 –35 –15 5 25 45 65 85 105
003
–55 –35 –15 5 25 45 65 85 105
006
TEMPERATURE (°C)
16865-
TEMPERATURE (°C)
16865- Figure 3. X-Axis Offset Drift, 15 Devices Soldered to PCB, VS = 2.5 V Figure 6. X-Axis Sensitivity vs. Temperature, 15 Devices Soldered to PCB, VS = 2.5 V
1.0 23.0 0.8 22.5 0.6 22.0 ) g / 0.4 ) 21.5 SB g 0.2 Y (L 21.0 IFT ( T R IVI 0 T 20.5 T D SI E –0.2 20.0 OFFS S SEN –0.4 XI 19.5 Y-A –0.6 19.0 –0.8 18.5 –1.0 18.0 –55 –35 –15 5 25 45 65 85 105
004
–55 –35 –15 5 25 45 65 85 105
007
TEMPERATURE (°C)
16865-
TEMPERATURE (°C)
16865- Figure 4. Y-Axis Offset Drift, 15 Devices Soldered to PCB, VS = 2.5 V Figure 7. Y-Axis Sensitivity vs. Temperature, 15 Devices Soldered to PCB, VS = 2.5 V
1.0 23.0 0.8 22.5 0.6 22.0 ) /g 0.4 ) 21.5 SB g 0.2 Y (L 21.0 IFT ( T R IVI 0 T 20.5 T D SI E –0.2 20.0 OFFS S SEN –0.4 XI 19.5 -A Z –0.6 19.0 –0.8 18.5 –1.0 18.0 –55 –35 –15 5 25 45 65 85 105
005
–55 –35 –15 5 25 45 65 85 105
008
TEMPERATURE (°C)
16865-
TEMPERATURE (°C)
16865- Figure 5. Z-Axis Offset Drift, 15 Devices Soldered to PCB, VS = 2.5 V Figure 8. Z-Axis Sensitivity vs. Temperature, 15 Devices Soldered to PCB, VS = 2.5 V Rev. 0 | Page 6 of 7 Document Outline Features Enhanced Product Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide
003
–55 –35 –15 5 25 45 65 85 105
006
TEMPERATURE (°C)
16865-
TEMPERATURE (°C)
16865- Figure 3. X-Axis Offset Drift, 15 Devices Soldered to PCB, VS = 2.5 V Figure 6. X-Axis Sensitivity vs. Temperature, 15 Devices Soldered to PCB, VS = 2.5 V
1.0 23.0 0.8 22.5 0.6 22.0 ) g / 0.4 ) 21.5 SB g 0.2 Y (L 21.0 IFT ( T R IVI 0 T 20.5 T D SI E –0.2 20.0 OFFS S SEN –0.4 XI 19.5 Y-A –0.6 19.0 –0.8 18.5 –1.0 18.0 –55 –35 –15 5 25 45 65 85 105
004
–55 –35 –15 5 25 45 65 85 105
007
TEMPERATURE (°C)
16865-
TEMPERATURE (°C)
16865- Figure 4. Y-Axis Offset Drift, 15 Devices Soldered to PCB, VS = 2.5 V Figure 7. Y-Axis Sensitivity vs. Temperature, 15 Devices Soldered to PCB, VS = 2.5 V
1.0 23.0 0.8 22.5 0.6 22.0 ) /g 0.4 ) 21.5 SB g 0.2 Y (L 21.0 IFT ( T R IVI 0 T 20.5 T D SI E –0.2 20.0 OFFS S SEN –0.4 XI 19.5 -A Z –0.6 19.0 –0.8 18.5 –1.0 18.0 –55 –35 –15 5 25 45 65 85 105
005
–55 –35 –15 5 25 45 65 85 105
008
TEMPERATURE (°C)
16865-
TEMPERATURE (°C)
16865- Figure 5. Z-Axis Offset Drift, 15 Devices Soldered to PCB, VS = 2.5 V Figure 8. Z-Axis Sensitivity vs. Temperature, 15 Devices Soldered to PCB, VS = 2.5 V Rev. 0 | Page 6 of 7 Document Outline Features Enhanced Product Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide