Datasheet LND150, LND250 (Microchip) - 14

制造商Microchip
描述N-Channel Depletion-Mode DMOS FETs
页数 / 页16 / 14 — LND150/LND250. PRODUCT IDENTIFICATION SYSTEM. PART NO. Examples:. Device. …
文件格式/大小PDF / 1.3 Mb
文件语言英语

LND150/LND250. PRODUCT IDENTIFICATION SYSTEM. PART NO. Examples:. Device. Package Environmental. Media. Options. Type

LND150/LND250 PRODUCT IDENTIFICATION SYSTEM PART NO Examples: Device Package Environmental Media Options Type

该数据表的模型线

文件文字版本

LND150/LND250 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. XX - X - X Examples: Device Package Environmental Media Options Type
a) LND150N3-G: N-Channel Depletion-Mode  DMOS FET, 3-lead TO-92, Devices: LND150 = N-Channel Depletion-Mode DMOS FET 1000/Bag LND250 = N-Channel Depletion-Mode DMOS FET b) LND150K1-G: N-Channel Depletion-Mode  Packages: N3 = 3-lead TO-92 DMOS FET, 3-lead SOT-23, K1 = 3-lead SOT-23 3000/Reel N8 = 3-lead SOT-89 c) LND150N8-G: N-Channel Depletion-Mode  Environmental: G = Lead (Pb)-free/ROHS-compliant package DMOS FET, 3-lead TO-92, 2000/Reel Media Types: (blank) = 1000/Bag for an N3 package = 3000/Reel for a K1 package d) LND150N3-G-P002: N-Channel Depletion-Mode  = 2000/Reel for an N8 package DMOS FET, 3-lead TO-92, P002 = 2000/Reel for an N3 package 2000/Reel P003 = 2000/Reel for an N3 package P013 = 2000/AMMO Pack for an N3 package P014 = 2000/AMMO Pack for an N3 package
Note: LND250 is only offered in 3-lead SOT-23 package.
DS20005454A-page 14  2018 Microchip Technology Inc. Document Outline N-Channel Depletion-Mode DMOS FETs Features Applications General Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings† DC Electrical Characteristics AC Electrical Characteristics Temperature Specifications Thermal Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Ambient Temperature. FIGURE 2-6: Thermal Response Characteristics. FIGURE 2-7: BVDSS Variation with Temperature. FIGURE 2-8: Transfer Characteristics. FIGURE 2-9: Capacitance vs. Drain-to- Source Voltage. FIGURE 2-10: Drain Current vs. RSOURCE. FIGURE 2-11: VGS(OFF) and RDS Variation with Temperature. FIGURE 2-12: Gate Drive Dynamic Characteristics. 3.0 Pin Description TABLE 3-1: TO-92 Pin Function Table TABLE 3-2: SOT-23 Pin Function Table TABLE 3-3: SOT-89 Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. TABLE 4-1: Product Summary 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Revision A (August 2018) Product Identification System Worldwide Sales and Service