Datasheet BM90 (Microchip) - 2

BM90 Module
To provide the superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications. For voice, not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancelation are implemented by the built-in DSP to reach the better quality in the both sending and receiving sides. For enhanced audio applications, SBC decoding functions can be also carried out by DSP to satisfy Bluetooth A2DP requirements. In addition, to minimize the external components required for portable devices, a battery voltage sensor , battery charger, a switching regulator and LDO are integrated to reduce system BOM cost for various Bluetooth applications.
Applications
 Stereo headsets  Portable speakerphones  Multi speaker. page 2 Document Outline Bluetooth® 3.0 Multi-Speaker Stereo Audio Module Features Description Applications Table of Contents 1.0 DEVICE OVERVIEW FIGURE 1-1: APPLICATION BLOCK DIAGRAM Audio Interface FIGURE 1-2: Analog audio interface block diagram FIGURE 1-3: Twin Speaker Link block diagram 2.0 Key Features Table 3.0 PIN DESCRIPTION TABLE 3-1: BM90 PIN DESCRIPTION 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS Table 4-1: Absolute Maximum Specifications Table 4-2: Recommended operating condition Table 4-3: Battery Charger Table 4-4: LED driver Table 4-5: Digital IO Table 4-6: Audio codec Digital to Analogue Converter Table 4-7: Audio codec Analogue to Digital Converter Table 4-8: Transmitter section for BDR Table 4-9: Transmitter section for EDR Table 4-10: Receiver section for BDR Table 4-11: Receiver section for EDR 4.2 PRINTED ANTENNA PERFORMANCE Table 4-12: Antenna Parameters FIGURE 4-1: Antenna 3D radiation pattern @2441 MHz 4.3 BQTF INFORMATION FIGURE 4-2: BQTF Information 4.4 CURRENT CONSUMPTION Table 4-13: Single Mode current consumption Table 4-14: Twin Mode: Master current consumption Table 4-15: Twin Mode: Slave current consumption 5.0 APPLICATIONS 5.1 EXTERNAL CONFIGURATION FIGURE 5-1: External Configuration Header Connections TABLE 5-1: SYSTEM CONFIGURATION SETTINGS 5.2 LED DRIVER 5.3 FUNCTION OF PIN TABLE 5-2: IOs for Buttons TABLE 5-3: IOs for added functions 5.4 Adaptive Frequency Hopping (AFH) 5.5 MULTI-SPEAKER 5.5.1 TWIN SPEAKER LINK TECHNOLOGY INTRODUCTION 5.5.1.1 TWIN SPEAKER LINK Figure 5-2 A2DP Twin Speaker Link Diagram 5.6 Mounting Details 5.7 Module Dimension FIGURE 5-3: BM90 module FIGURE 5-4: Outline Dimension FIGURE 5-5: Module Foot print 5.8 Main Board Antenna Area Layout Guide FIGURE 5-6: Mother Board Antenna Area Layout Guide 5.9 RFLOW PROFILE 5.9.1Soldering Recommendations FIGURE 5-7: Reflow profile 6.0 REFERENCE CIRCUIT FIGURE 6-1: BM90 reference circuit 7.0 PACKING INFORMATION 7.1 QR code label information 7.2 Storage standard 7.3 Ordering Information 7.4 Tray Dimensions 7.5 Packing Method