Datasheet HMC8142 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 81 GHz to 86 GHz, E-Band Power Amplifier with Power Detector |
| 页数 / 页 | 16 / 7 — Data Sheet. HMC8142. TYPICAL PERFORMANCE CHARACTERISTICS. GAIN. INPUT … |
| 修订版 | A |
| 文件格式/大小 | PDF / 319 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC8142. TYPICAL PERFORMANCE CHARACTERISTICS. GAIN. INPUT RETURN LOSS. OUTPUT RETURN LOSS. SE (d. N ( AI. ESPO R. –10
该数据表的模型线
文件文字版本
Data Sheet HMC8142 TYPICAL PERFORMANCE CHARACTERISTICS 30 25 25 24 20 23 15 22 ) GAIN B INPUT RETURN LOSS 10 OUTPUT RETURN LOSS 21 B) SE (d d N 5 20 N ( AI 0 G 19 ESPO R –5 18 –10 17 TA = +85°C TA = +25°C –15 16 TA = –55°C –20 15 79 80 81 82 83 84 85 86 87 88
009
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
012
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, Figure 12. Gain vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA
25 –5 24 I –7 T DD = 350mA A = +85°C I T DD = 400mA A = +25°C 23 IDD = 450mA –9 TA = –55°C 22 –11 B) d 21 ( –13 B) S d S O 20 N ( –15 AI G 19 URN L –17 T 18 RE –19 17 –21 16 –23 15 –25 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
010
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
013
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 10. Gain vs. Frequency at Various Drain Currents (IDD) Figure 13. Input Return Loss vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA
0 –44 –2 –46 TA = +85°C TA = +25°C –4 T –48 A = –55°C –6 –50 B) ) d ( –8 S dB –52 ( S O –10 –54 TION URN L –12 OLA –56 T IS RE –14 –58 T –16 A = +85°C –60 TA = +25°C T –18 A = –55°C –62 –20
1
–64
1
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
0
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
014
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 11. Output Return Loss vs. Frequency at Various Temperatures, Figure 14. Reverse Isolation vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA Rev. A | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
009
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
012
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, Figure 12. Gain vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA
25 –5 24 I –7 T DD = 350mA A = +85°C I T DD = 400mA A = +25°C 23 IDD = 450mA –9 TA = –55°C 22 –11 B) d 21 ( –13 B) S d S O 20 N ( –15 AI G 19 URN L –17 T 18 RE –19 17 –21 16 –23 15 –25 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
010
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
013
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 10. Gain vs. Frequency at Various Drain Currents (IDD) Figure 13. Input Return Loss vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA
0 –44 –2 –46 TA = +85°C TA = +25°C –4 T –48 A = –55°C –6 –50 B) ) d ( –8 S dB –52 ( S O –10 –54 TION URN L –12 OLA –56 T IS RE –14 –58 T –16 A = +85°C –60 TA = +25°C T –18 A = –55°C –62 –20
1
–64
1
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
0
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
014
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 11. Output Return Loss vs. Frequency at Various Temperatures, Figure 14. Reverse Isolation vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA Rev. A | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE