Datasheet HMC-AUH318 (Analog Devices) - 3
| 制造商 | Analog Devices |
| 描述 | GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 71 -76 GHz |
| 页数 / 页 | 6 / 3 — HMC-AUH318. GaAs HEMT MMIC MEDIUM POWER. AMPLIFIER, 71 - 76 GHz. Absolute … |
| 文件格式/大小 | PDF / 298 Kb |
| 文件语言 | 英语 |
HMC-AUH318. GaAs HEMT MMIC MEDIUM POWER. AMPLIFIER, 71 - 76 GHz. Absolute Maximum Ratings. Reliability Information
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HMC-AUH318
v07.0713
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 71 - 76 GHz Absolute Maximum Ratings Reliability Information
Nominal 4.0V Supply to GND 0.0V to +4.5V Junction Temperature to Maintain 180 °C 1 Million Hour MTTF Gate Bias Voltage -0.8V to +0.3V 3 Nominal Junction Temperature (T = 85 °C) 156.5 °C RF Input Power (Vdd = +4.0V) +3 dBm Thermal Resistance (Junction to Die Bottom) 111.7 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Max Peak Reflow Temperature 260 °C Drain Bias Current (Idd1) 100 mA IP Drain Bias Current (Idd2) 100 mA H ELECTROSTATIC SENSITIVE DEVICE DO NOT EXPOSE PRODUCT TO CONDENSING OBSERVE HANDLING PRECAUTIONS MOISTURE WHILE UNDER OPERATION. R - C
Outline Drawing
E W O R & P A E IN S - L R IE LIF P M A NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. BACKSIDE METALLIZATION: GOLD. Standard Alternate 3. BACKSIDE METAL IS GROUND. GP-1 (Gel Pack) [2] 4. BOND PAD METALLIZATION: GOLD. 5. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [1] Refer to the “Packaging Information” section for die 6. OVERALL DIE SIZE ±.002” packaging dimensions. 7. DIE THICKNESS IS 0.002” [0.050 mm] [2] For alternate packaging information contact Hittite 8 TYPICAL BOND PAD IS 0.004” [0.100 mm] SQUARE UNLESS NOTED Microwave Corporation. Inf F or o m r p ation rfic ur e nis, d he e d lbiy ve An ry a alog n Ded t vice o p s is la belciee o ved rd to e b r e sa: H ccur iattte itae M nd reliic a r bl o e. w H a o v we e C ver, noo For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
3 - 3
Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No Ph rd on e e r O : 7 n 81- - 3 li 2 n 9-e a 470 t ww 0 • O w rd . e hi r ott nliite n .c e a o t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 pli o cat ri a o p n S p ups@ por h t it : Ptit hoen.c e om : 1-800-ANALOG-D
v07.0713
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 71 - 76 GHz Absolute Maximum Ratings Reliability Information
Nominal 4.0V Supply to GND 0.0V to +4.5V Junction Temperature to Maintain 180 °C 1 Million Hour MTTF Gate Bias Voltage -0.8V to +0.3V 3 Nominal Junction Temperature (T = 85 °C) 156.5 °C RF Input Power (Vdd = +4.0V) +3 dBm Thermal Resistance (Junction to Die Bottom) 111.7 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Max Peak Reflow Temperature 260 °C Drain Bias Current (Idd1) 100 mA IP Drain Bias Current (Idd2) 100 mA H ELECTROSTATIC SENSITIVE DEVICE DO NOT EXPOSE PRODUCT TO CONDENSING OBSERVE HANDLING PRECAUTIONS MOISTURE WHILE UNDER OPERATION. R - C
Outline Drawing
E W O R & P A E IN S - L R IE LIF P M A NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. BACKSIDE METALLIZATION: GOLD. Standard Alternate 3. BACKSIDE METAL IS GROUND. GP-1 (Gel Pack) [2] 4. BOND PAD METALLIZATION: GOLD. 5. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [1] Refer to the “Packaging Information” section for die 6. OVERALL DIE SIZE ±.002” packaging dimensions. 7. DIE THICKNESS IS 0.002” [0.050 mm] [2] For alternate packaging information contact Hittite 8 TYPICAL BOND PAD IS 0.004” [0.100 mm] SQUARE UNLESS NOTED Microwave Corporation. Inf F or o m r p ation rfic ur e nis, d he e d lbiy ve An ry a alog n Ded t vice o p s is la belciee o ved rd to e b r e sa: H ccur iattte itae M nd reliic a r bl o e. w H a o v we e C ver, noo For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
3 - 3
Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No Ph rd on e e r O : 7 n 81- - 3 li 2 n 9-e a 470 t ww 0 • O w rd . e hi r ott nliite n .c e a o t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 pli o cat ri a o p n S p ups@ por h t it : Ptit hoen.c e om : 1-800-ANALOG-D