Datasheet HMC8400 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 30 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| 页数 / 页 | 15 / 7 — Data Sheet. HMC8400. TYPICAL PERFORMANCE CHARACTERISTICS. S11. S21. S22. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 313 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC8400. TYPICAL PERFORMANCE CHARACTERISTICS. S11. S21. S22. SE (d. +85°C. N (. +25°C. –55°C. –10. ESPO R. –15. –20. –25. –30
该数据表的模型线
文件文字版本
Data Sheet HMC8400 TYPICAL PERFORMANCE CHARACTERISTICS 20 16 15 10 14 S11 5 S21 ) S22 B 0 12 B) SE (d d +85°C N –5 N ( +25°C AI –55°C –10 G 10 ESPO R –15 –20 8 –25 –30 6 0 4 8 12 16 20 24 28 32 36
006
2 6 10 14 18 22 26 30
007
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 8. Response Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C –5 +25°C +25°C –55°C –5 –55°C B) –10 B) d d ( ( S –10 S S S O O –15 URN L URN L –15 T T –20 RE RE –20 –25 –30 –25 2 6 10 14 18 22 26 30
008
2 6 10 14 18 22 26 30
009
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
5 18 +85°C 17 +25°C +85°C –55°C +25°C 4 –55°C 16 ) 15 dB ( 3 E 14 R Bm) d 13 B ( FIGU E 1d 2 P 12 OIS N 11 1 10 9 0 8
1 1
2 4 6 8 10 12 14 16 18 20 22 24 26 28
010
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
0
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. P1dB vs. Frequency at Various Temperatures Rev. B | Page 7 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
006
2 6 10 14 18 22 26 30
007
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 8. Response Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C –5 +25°C +25°C –55°C –5 –55°C B) –10 B) d d ( ( S –10 S S S O O –15 URN L URN L –15 T T –20 RE RE –20 –25 –30 –25 2 6 10 14 18 22 26 30
008
2 6 10 14 18 22 26 30
009
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
5 18 +85°C 17 +25°C +85°C –55°C +25°C 4 –55°C 16 ) 15 dB ( 3 E 14 R Bm) d 13 B ( FIGU E 1d 2 P 12 OIS N 11 1 10 9 0 8
1 1
2 4 6 8 10 12 14 16 18 20 22 24 26 28
010
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
0
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. P1dB vs. Frequency at Various Temperatures Rev. B | Page 7 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE