Datasheet ADG1221, ADG1222, ADG1223 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Low Capacitance, Low Charge Injection, ±15 V/+12 V iCMOS Dual SPST Switches |
| 页数 / 页 | 16 / 6 — ADG1221/ADG1222/ADG1223. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| 修订版 | B |
| 文件格式/大小 | PDF / 451 Kb |
| 文件语言 | 英语 |
ADG1221/ADG1222/ADG1223. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating
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文件文字版本
ADG1221/ADG1222/ADG1223 Data Sheet ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
Table 3.
soldered in a circuit board for surface-mount packages.
Parameter Rating
VDD to VSS 35 V
Table 4. Thermal Resistance
VDD to GND –0.3 V to +25 V
Package Type θJA θJC Unit
VSS to GND +0.3 V to −25 V 10-Lead MSOP (4-Layer Board) 206 44 °C/W Analog Inputs1 VSS – 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first Digital Inputs1 GND – 0.3 V to VDD + 0.3 V or
ESD CAUTION
30 mA, whichever occurs first Peak Current, S or D 100 mA (pulsed at 1 ms, 10% duty cycle max) Continuous Current per 30 mA Channel, S or D Operating Temperature Range –40°C to +125°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260°C Temperature, Pb free 1 Overvoltages at IN, S, or D are clamped by internal diodes. Current must be limited to the maximum ratings given. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
Table 3.
soldered in a circuit board for surface-mount packages.
Parameter Rating
VDD to VSS 35 V
Table 4. Thermal Resistance
VDD to GND –0.3 V to +25 V
Package Type θJA θJC Unit
VSS to GND +0.3 V to −25 V 10-Lead MSOP (4-Layer Board) 206 44 °C/W Analog Inputs1 VSS – 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first Digital Inputs1 GND – 0.3 V to VDD + 0.3 V or
ESD CAUTION
30 mA, whichever occurs first Peak Current, S or D 100 mA (pulsed at 1 ms, 10% duty cycle max) Continuous Current per 30 mA Channel, S or D Operating Temperature Range –40°C to +125°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260°C Temperature, Pb free 1 Overvoltages at IN, S, or D are clamped by internal diodes. Current must be limited to the maximum ratings given. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE