Datasheet TDA7050 (NXP) - 7
| 制造商 | NXP |
| 描述 | Low Voltage Mono/Stereo Power Amplifier |
| 页数 / 页 | 8 / 7 — PACKAGE OUTLINE. DIP8: plastic dual in-line package; 8 leads (300 mil). … |
| 文件格式/大小 | PDF / 70 Kb |
| 文件语言 | 英语 |
PACKAGE OUTLINE. DIP8: plastic dual in-line package; 8 leads (300 mil). SOT97-1
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文件文字版本
Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050
PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D ME A2 A seating plane A L 1 c Z w M b1 e (e ) 1 MH b b2 8 5 pin 1 index E 1 4 0 5 10 mm scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions) A A A UNIT 1 2 b b (1) (1) (1) b e L M w max. 1 2 c D E e M Z 1 E H min. max. max.
1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0 mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15 1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3 inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.39 0.17 0.020 0.13 0.10 0.30 0.01 0.045 0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
92-11-17 SOT97-1 050G01 MO-001AN 95-02-04 June 1989 7
PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D ME A2 A seating plane A L 1 c Z w M b1 e (e ) 1 MH b b2 8 5 pin 1 index E 1 4 0 5 10 mm scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions) A A A UNIT 1 2 b b (1) (1) (1) b e L M w max. 1 2 c D E e M Z 1 E H min. max. max.
1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0 mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15 1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3 inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.39 0.17 0.020 0.13 0.10 0.30 0.01 0.045 0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
92-11-17 SOT97-1 050G01 MO-001AN 95-02-04 June 1989 7