Datasheet TDA7050 (NXP) - 8
| 制造商 | NXP |
| 描述 | Low Voltage Mono/Stereo Power Amplifier |
| 页数 / 页 | 8 / 8 — SOLDERING. Introduction. Repairing soldered joints. Soldering by dipping … |
| 文件格式/大小 | PDF / 70 Kb |
| 文件语言 | 英语 |
SOLDERING. Introduction. Repairing soldered joints. Soldering by dipping or by wave. DEFINITIONS. Data sheet status
该数据表的模型线
文件文字版本
Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050
SOLDERING
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
Introduction
specified maximum storage temperature (Tstg max). If the There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the through-hole and surface mounted components are mixed temperature within the permissible limit. on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for
Repairing soldered joints
printed-circuits with high population densities. In these Apply a low voltage soldering iron (less than 24 V) to the situations reflow soldering is often used. lead(s) of the package, below the seating plane or not This text gives a very brief insight to a complex technology. more than 2 mm above it. If the temperature of the A more in-depth account of soldering ICs can be found in soldering iron bit is less than 300 °C it may remain in our “IC Package Databook” (order code 9398 652 90011). contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
DEFINITIONS Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1989 8
SOLDERING
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
Introduction
specified maximum storage temperature (Tstg max). If the There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the through-hole and surface mounted components are mixed temperature within the permissible limit. on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for
Repairing soldered joints
printed-circuits with high population densities. In these Apply a low voltage soldering iron (less than 24 V) to the situations reflow soldering is often used. lead(s) of the package, below the seating plane or not This text gives a very brief insight to a complex technology. more than 2 mm above it. If the temperature of the A more in-depth account of soldering ICs can be found in soldering iron bit is less than 300 °C it may remain in our “IC Package Databook” (order code 9398 652 90011). contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
DEFINITIONS Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1989 8