Datasheet AD5593R (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 8-Channel, 12-Bit, Configurable ADC/DAC with On-Chip Reference, I2C Interface |
| 页数 / 页 | 33 / 7 — Data Sheet. AD5593R. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| 修订版 | D |
| 文件格式/大小 | PDF / 802 Kb |
| 文件语言 | 英语 |
Data Sheet. AD5593R. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. Parameter. Rating. Table 5. Thermal Resistance
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Data Sheet AD5593R ABSOLUTE MAXIMUM RATINGS
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 4. Parameter Rating Table 5. Thermal Resistance
VDD to GND −0.3 V to +7 V
Package Type θJA Unit
VLOGIC to GND −0.3 V to +7 V 16-Lead TSSOP 112 °C/W Analog Input Voltage to GND −0.3 V to VDD + 0.3 V 16-Lead LFCSP 137 °C/W Digital Input Voltage to GND −0.3 V to VLOGIC + 0.3 V 16-ball WLCSP 60 °C/W Digital Output Voltage to GND −0.3 V to VLOGIC +0.3 V VREF to GND −0.3 V to VDD +0.3 V Operating Temperature Range −40°C to +105°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) +150°C Lead Temperature JEDEC industry-standard Soldering J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 7 of 33 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Characteristics Timing Diagram Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Terminology Theory of Operation DAC Section Resistor String DAC Output Buffer ADC Section Calculating ADC Input Current GPIO Section Internal Reference Reset Function Temperature Indicator Serial Interface Write Operation Read Operation Pointer Byte Control Registers General-Purpose Control Register Configuring the AD5593R DAC Write Operation LDAC Mode Operation DAC Readback ADC Operation GPIO Operation Setting Pins as Outputs Setting Pins as Inputs Three-State Pins 85 kΩ Pull-Down Pins Power-Down/Reference Control Reset Function Applications Information Microprocessor Interfacing AD5593R to ADSP-BF537 Interface Layout Guidelines Outline Dimensions Ordering Guide
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 4. Parameter Rating Table 5. Thermal Resistance
VDD to GND −0.3 V to +7 V
Package Type θJA Unit
VLOGIC to GND −0.3 V to +7 V 16-Lead TSSOP 112 °C/W Analog Input Voltage to GND −0.3 V to VDD + 0.3 V 16-Lead LFCSP 137 °C/W Digital Input Voltage to GND −0.3 V to VLOGIC + 0.3 V 16-ball WLCSP 60 °C/W Digital Output Voltage to GND −0.3 V to VLOGIC +0.3 V VREF to GND −0.3 V to VDD +0.3 V Operating Temperature Range −40°C to +105°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) +150°C Lead Temperature JEDEC industry-standard Soldering J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 7 of 33 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Characteristics Timing Diagram Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Terminology Theory of Operation DAC Section Resistor String DAC Output Buffer ADC Section Calculating ADC Input Current GPIO Section Internal Reference Reset Function Temperature Indicator Serial Interface Write Operation Read Operation Pointer Byte Control Registers General-Purpose Control Register Configuring the AD5593R DAC Write Operation LDAC Mode Operation DAC Readback ADC Operation GPIO Operation Setting Pins as Outputs Setting Pins as Inputs Three-State Pins 85 kΩ Pull-Down Pins Power-Down/Reference Control Reset Function Applications Information Microprocessor Interfacing AD5593R to ADSP-BF537 Interface Layout Guidelines Outline Dimensions Ordering Guide