Datasheet HMC659 (Analog Devices) - 5

HMC659
v02.0217
GaAs PHEMT MMIC POWER AMPLIFIER, DC - 15 GHz Outline Drawing
IP H R - C E W O R & P A E IN S - L R IE LIF P
Die Packaging Information
[1] NOTES: M 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate A 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE GP-1 (Gel Pack) [2] 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section for die 5. BACKSIDE METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS [2] For alternate packaging information contact Hittite 8. OVERALL DIE SIZE IS ±.002 Microwave Corporation. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D